Description

The latest advances in three-dimensional integrated circuit stacking technology. With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.

More Details about 3D IC Stacking Technology

General Information  
Author(s)Banqiu Wu
PublisherMcGraw Hill
Edition1
ISBN9780071741958
Pages520
BindingHardcover
LanguageEnglish
Publish YearJanuary 2011