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3D IC Stacking Technology

3D IC Stacking Technology
Books from same Author: Banqiu Wu
Books from same Publisher: McGraw Hill

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Description

The latest advances in three-dimensional integrated circuit stacking technology. With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.

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General Information
Author(s)Banqiu Wu
PublisherMcGraw Hill
Edition1
ISBN9780071741958
Pages520
BindingHardcover
LanguageEnglish
Publish YearJanuary 2011
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