Description
John Wiley And Sons Advanced Electronic Packaging 2Nd Edition by Bates and Bates P D and Burton and Cia and Cormack and Cormack Dfs and Ennos and Ennos R and Hauschke D and Ho and Khonsari M M and Kubinyi and Kubinyi H and Lengauer and Lengauer T and Liu and Mcg
As in the
First Edition, each chapter in this new
Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the
First Edition, which became an industry standard and a popular graduate-level textbook, have been retained.
An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.