Description
Springer Directions For The Next Generation Of Mmic Devices And Systems 1997 Edition by Nirod K. Das Henry L. Bertoni
Microwave and millimeter-wave integrated circuits (MMICs) are of increasing im- portance in modern military and commercial wireless communication systems. Current trends are towards low-cost high-density multileveland multifunctional integration cover- ingmillimeterand submillimeterwave regions.The integrationofdiverse subfunctions such as light-wave devices superconductor circuits digital circuits and ferrite devices together with conventional microwave or millimeter-wave devices circuits and antennas will allow implementation of large systems on a single chip. Research on advanced device concepts 3-D interconnects high-performance packaging methods advanced CAD-tools measure- ment and testing techniques as weil as material and fabrication technologies are being di- rected to meet these new challenges. Continuing on the series ofsymposia sponsored by the Weber Research Institute of Polytechnic University an international symposium focusing on the current developments and new research initiatives for the next generation ofmicrowave and millimeter wave inte- grated circuits and systems was held at Brooklyn New Yorkduring September 11-13 1996.The symposium was organizedas a3-dayeventrunning mostly ina single-session format of regular papers and panel discussions It was co-sponsored by the Army Research Office Re- search Triangle Park NC in cooperation with the IEEE Microwave Theory and Techniques Society the IEEE Antennas and Propagation Society and IEEE Long Island and New York MetropolitanSections.The papers published in this volume are extended versionsofselected papers presented at this symposium. Table of contents : Introduction: Scanning the Conference; N.K. Das H.L. Bertoni. Historical Perspectives on Microwave and Millimeter Wave Integrated Circuits; A.A. Onliner. MAFET THRUST 3: A Revolutionary Program for Solid-State Microwave and Millimeter-Wave Power; E.R. Brown. Systems and Integration: High-Density Microwave Packaging Technology Development for Department of Defense Application; F. Lamb et al. Flip Mounted Power MMICs Packaging Technology; T.C. Tisco Multilayer Vettical Interconnection Technology; F.Y. Colomb. Novel Antennas and Device Technology: Broadbanding Guide-Lines of Strip-Element Microstrip Phased Arrays; A. Hessel U-Slot Patch Wideband Microstrip Antenna; K.F. Lee et al. Surface-Wave Mode Reduction for Rectangular Microstrip Antennas on High-Index Materials; J. Papapolymerou et al. Modeling and CAD: Types of Leaky Dominant Modes and Spectral Gaps on Printed-Circuit Lines; A.A. Oliner 2-D Integral Spectral-Domain Analysis of Leaky Modes in Covered and Uncovered Microstrip Lines; R. Marques F. Mesa Excitation of Leaky Modes on Printed-Circuit Structures by Practical Feeds: An Investigation of Physical Meaning; F. Mesa et al. 31 Additional Articles. Index.