Description
Taylor & Francis Practical Guide to the Packaging of Electronics Thermal and Mechanical Design and Analysis 2002 Edition by Ali Jamnia
Whether you are designing a new system or troubleshooting a current one, this ingenious text offers a wealth of valuable information. The author focuses on reliability problems and the design of systems with incomplete criteria and components and provides a simple approach for estimating thermal and mechanical characteristics of electronic systems.Practical Guide to the Packaging of Electronics discussesPackaging/enclosure design and reliability Thermal, junction-to-case, and contact interface resistance Direct and indirect flow system design Fin design and fan selection Vital elements of shock and vibration Thermal stresses and strains in the design and analysis of mechanically reliable systems Reliability models and system failure The selection of engineering software to facilitate system analysis Design parameters in an avionics electronics package Practical Guide to the Packaging of Electronics is an excellent refresher for mechanical, biomedical, electrical and electronics, manufacturing, materials, and quality and reliability engineers, and will be an invaluable text for upper-level undergraduate and graduate students in these disciplines. Table of Contents : Introduction Basic Heat Transfer: Conduction, Convection and Radiation Conductive Cooling Radiation Cooling Fundamentals of Convection Cooling Basics of Shock and Vibration Introduction to Finite Element Method Design and Analysis for Mechanically Reliable Systems Electrical Reliability Some Analysis Tips in Using Finite Element Methods Design Considerations in an Avionics Electronic Package References Index