Description

Proven 2D and 3D IC lead-free interconnect reliability techniques. Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource.

More Details about Reliability of Rohs-compliant 2d and 3d Ic Interconnects

General Information  
Author(s)Lau
PublisherMcGraw Hill
Edition1
ISBN9780071753791
Pages606
BindingHardcover
LanguageEnglish
Publish YearJanuary 2011