×







We sell 100% Genuine & New Books only!

Thermal Stress Analysis Of Composite Beams, Plates And Shells : Computational Modelling And Applications at Meripustak

Thermal Stress Analysis Of Composite Beams, Plates And Shells : Computational Modelling And Applications by Carrera E, Elsevier Science

Books from same Author: Carrera E

Books from same Publisher: Elsevier Science

Related Category: Author List / Publisher List


  • Price: ₹ 14671.00/- [ 19.00% off ]

    Seller Price: ₹ 11884.00

Estimated Delivery Time : 4-5 Business Days

Sold By: Meripustak      Click for Bulk Order

Free Shipping (for orders above ₹ 499) *T&C apply.

In Stock

We deliver across all postal codes in India

Orders Outside India


Add To Cart


Outside India Order Estimated Delivery Time
7-10 Business Days


  • We Deliver Across 100+ Countries

  • MeriPustak’s Books are 100% New & Original
  • General Information  
    Author(s)Carrera E
    PublisherElsevier Science
    ISBN9780128498927
    Pages440
    BindingSoftbound
    LanguageEnglish
    Publish YearDecember 2016

    Description

    Elsevier Science Thermal Stress Analysis Of Composite Beams, Plates And Shells : Computational Modelling And Applications by Carrera E

    Thermal Stress Analysis of Composite Beams, Plates and Shells: Computational Modelling and Applications presents classic and advanced thermal stress topics in a cutting-edge review of this critical area, tackling subjects that have little coverage in existing resources. It includes discussions of complex problems, such as multi-layered cases using modern advanced computational and vibrational methods. Authors Carrera and Fazzolari begin with a review of the fundamentals of thermoelasticity and thermal stress analysis relating to advanced structures and the basic mechanics of beams, plates, and shells, making the book a self-contained reference. More challenging topics are then addressed, including anisotropic thermal stress structures, static and dynamic responses of coupled and uncoupled thermoelastic problems, thermal buckling, and post-buckling behavior of thermally loaded structures, and thermal effects on panel flutter phenomena, amongst others.



    Book Successfully Added To Your Cart