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Handbook Of Semiconductor Interconnection Technology 2Nd Edition at Meripustak

Handbook Of Semiconductor Interconnection Technology 2Nd Edition by Geraldine Cogin Shwartz And Geraldine C. Schwartz, T&F India

Books from same Author: Geraldine Cogin Shwartz And Geraldine C. Schwartz

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  • General Information  
    Author(s)Geraldine Cogin Shwartz And Geraldine C. Schwartz
    PublisherT&F India
    EditionEdition New edition
    ISBN9781574446746
    Pages536
    BindingHard Binding
    LanguageEnglish
    Publish YearFebruary 2006

    Description

    T&F India Handbook Of Semiconductor Interconnection Technology 2Nd Edition by Geraldine Cogin Shwartz And Geraldine C. Schwartz

    First Introduced About A Decade Ago The First Edition Of The Handbook Of Semiconductor Interconnection Technology Became Widely Popular For Its Thorough Integrated Treatment Of Interconnect Technologies And Its Forward-Looking Perspective. The Field Has Grown Tremendously In The Interim And Many Of The Likely Directions Outlined In The First Edition Are Now Standard In Modern Facilities. Reflecting Those Advances This Edition Delves Into The Practical Aspects Of Interconnections For Manufacturing. It Examines The Interconnect And Fabrication Technologies Now Available With An Examination Of Future Prospects For The Field.WhatS In This Edition:Detailed Discussion Of Electrochemical Equipment For Plating Copperinformation On Tools Used For Evaporation Chemical Vapor Deposition And Plasma Processesemphasis On Measurement Of Mechanical And Thermal Properties Of Insulatorsmethods For Characterizing Porous Dielectric Thin Filmsgreater Focus On Integration Issues And Properties Of Titanium Cobalt And Nickel Silicidesprocess Schemes Based On The Increased Need For Borderless Contact Gates And Source/Drainexpanded Discussion On Choices For Low-Dielectric Insulatorsconcentration On Electroplated Copper Especially Morphology Of Plated Films And Their Propertiesdevelopments In Thin Film Liners And Barriersexpanded Material On Copper Reliabilityshow More



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