Description
SPRINGER Initiatives Of Precision Engineering At The Beginning Of A Millennium by NASAKI
Faced with ever-increasing market demands, manufacturing industry is forced to seek innovation and technological breakthrough. This state-of-the-art text aims to integrate broad aspects of precision and production engineering to cope with rapid changes in market needs and technological developments as we enter the 21st century. It addresses basic theory, extensive research in advanced topics, industrial applications, and relevant surveys in related fields. Major subjects covered by this book include: Advanced manufacturing systems; Ultra-precision machining and micro machining; Nanotechnology for fabrication and measurement; Chemo-mechanical processes; Rapid prototyping technology; New materials and advanced processes; Computer-aided production engineering; Manufacturing process control; Planning. This volume contains the proceedings of the 10th International Conference on Precision Engineering (ICPE), which was held in July 2001, in Yokohama, Japan. ICPE is a well-established conference in the field of production and precision engineering, covering a wide range of topics for future-oriented manufacturing systems and processes; it is organized by the Japan Society for Precision Engineering (JSPE). This book can be used as a reference for graduate and undergraduate courses in precision and production engineering, and also for researchers and industrial engineers to capture current trends in this field. Preface. Organizing Committee, International Advisory Committee and Conference Executive Committee. Keynote Paper. Machining of Precision Parts and Microstructures; E. Brinksmeier, et al. Roles of Quantum Nanostructures in Advanced Electronics; H. Sakaki. Design of New Precision Machine Elements; A.H. Slocum. Part I: Cutting / Special machining. The Concept of Active Deflection Compensation and its Application in Precision Forging; E. Doege, et al. Coining of Thin Plates to Produce Micro Channel Structures; G. Hirt, B. Rattay. Three-dimensional Micro-Forming Process of Thin Film Metallic Glass in the Supercooled Liquid Region; S. Hata, et al. Precision Cold Forging - Methods for Reduction of Working Pressure; K.K. Tong, et al. Burr Formation in Micro-Machining Aluminum, 6061-T6; K. Lee, et al. Micro Structuring of High Aspect Ratio and Array by Means of Mechanical Machining; K. Sawada, et al. Influence of Micro Machining on Strength Degradation of a Silicon Nitride Ceramic; M. Wakuda, et al. Micro Material Processing Using UV Laser and Femtosecond Laser; H.K. Toenshoff, et al. Subnanometer Fabrication of Optics by Plasma Chemical Vaporization Machining; H. Takino, et al. Micro Fabrication Using EDM Deposition; S. Hayakawa, et al. Manufacture of Aspherical Fresnel Lens with Ideal Cross-Sectional Profile with Oxygen-free Copper and Acrylic Resin; N. Sornsuwit, et al. Non-circular Machining Using Two Convex Milling Cutters; Y. Nakao. 54 Additional Chapters. Part II: Grinding / polishing / ultra-precision machining. Precision Grinding of Micro Aspherical Surface; H. Suzuki, et al. Mirror Grinding of Silicon Wafer with Silica EPD Pellets; T. Fukazawa, et al. New Fabrication Process ofDeep Paraboloidal Mirror by Combination of ELID-Grinding and Electro-forming Techniques for Laman Spectroscopy Instrument; H. Ohmori, et al. A Study on the Surface Integrity of Single Crystal Silicon Ground by CIFB-diamond Wheels (ELID) and Resin-bonded Diamond Wheels; C.L. Chao, et al. A Study on Scratch Reduction Using the Sonic Dispersion of CMP Slurry; S.H. Choi, et al. A Study on the Chemical Mechanical Micro Machining (C3M) of Silicon; S.C. Jeong, et al. Development of a Lapping Film Utilizing Agglomerative Superfine Silica Abrasives for Edge Finishing of a Silicon Wafer; T. Enomoto, et al. Cryogenic Polishing Method of Optical Materials; F. Zhang, et al. Characteristics of Small Rotary Tool in Polishing of Fused Silica; C. Liu, et al. Development of Electrostrictive Polyurethane(PU) Films and its Characterization; E.-S. Jeong, et al. Precision Machining of Future Silicon Wafers; F. Klocke, D. Pahler. High Speed Grinding Performance and Material Removal Mechanism of Silicon Nitride; H. Huang, L. Yin. 19 Additional Chapters. Part III: Machine / element / measurement. Invited paper: Precision Machine Tools; M. Weck, et al. Effects of Bearing Surface Geometries on the Inclination Stiffness of Aerostatic Thrust Bearings; S. Ohishi, et al. Development of a Three Axes Travelling Column Ultraprecision Milling Machine; A. Herrero, R. Bueno. Development of Hydrostatic Bearings with Groove Structures; M. Weck, et al. Asasessment of Thermophysical Properties at Design Stage of Machine Tool Structure with Thermal Symmetricity; M. Okabe, et al. Concrete-Based Constrained Layer Damping; E. Bamberg, A.H. Slocum. Effects of Manufacturing Errors on the Accuracy for TRR-XY Hybrid PKM; T.-H. Chang, et al. Effect of Static Stiffness of Grinding Systems o