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Circuit Oriented Electromagnetic Modeling Using The Peec Techniques at Meripustak

Circuit Oriented Electromagnetic Modeling Using The Peec Techniques by Albert Ruehli ,  Giulio Antonini ,   Lijun Jiang, John Wiley & Sons Inc

Books from same Author: Albert Ruehli ,  Giulio Antonini ,   Lijun Jiang

Books from same Publisher: John Wiley & Sons Inc

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  • General Information  
    Author(s)Albert Ruehli ,  Giulio Antonini ,   Lijun Jiang
    PublisherJohn Wiley & Sons Inc
    Edition1. Auflage
    ISBN9781118436646
    Pages464
    BindingHardback 
    LanguageEnglish
    Publish YearJuly 2017

    Description

    John Wiley & Sons Inc Circuit Oriented Electromagnetic Modeling Using The Peec Techniques by Albert Ruehli ,  Giulio Antonini ,   Lijun Jiang

    Bridges The Gap Between Electromagnetics And Circuits By Addressing Electrometric Modeling (Em) Using The Partial Element Equivalent Circuit (Peec) Method This Book Provides Intuitive Solutions To Electromagnetic Problems By Using The Partial Element Equivalent Circuit (Peec) Method. This Book Begins With An Introduction To Circuit Analysis Techniques Laws And Frequency And Time Domain Analyses. The Authors Also Treat MaxwellS Equations Capacitance Computations And Inductance Computations Through The Lens Of The Peec Method. Next Readers Learn To Build Peec Models In Various Forms: Equivalent Circuit Models Non-Orthogonal Peec Models Skin-Effect Models Peec Models For Dielectrics Incident And Radiate Field Models And Scattering Peec Models. The Book Concludes By Considering Issues Like Stability And Passivity And Includes Five Appendices Some With Formulas For Partial Elements.* Leads Readers To The Solution Of A Multitude Of Practical Problems In The Areas Of Signal And Power Integrity And Electromagnetic Interference * Contains Fundamentals Applications And Examples Of The Peec Method * Includes Detailed Mathematical Derivations Circuit Oriented Electromagnetic Modeling Using The Peec Techniques Is A Reference For Students Researchers And Developers Who Work On The Physical Layer Modeling Of Ic Interconnects And Packaging Pcbs And High Speed Links.



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