Description
New Age International (P) Ltd., Publishers Principles Of Reliable Soldering Techniques by Dr. R Sengupta
Soldering, though being an age old phenomenon, is still perhaps a difficult subject to understand, due to its interdisciplinary nature. In this book, efforts have been made to describe the physical theories responsible for making a good joint, the chemical actions during its formation and the electrical, thermal and mechanical requirements essential to ensure its reliability. The four M's; material, machine, method and man, necessary for designing a solder joint have been described in detail. Further, process control, solder joint inspection criteria, solder joint defect analysis and its repair/rework are also discussed.
Additionally, brief introductions to Surface Mount Devices (SMD) and Surface Mount Technology (SMT) have been included a annexures. The book will be useful in industry, and to design production, process planning and quality control engineers, as well as in engineering/technical colleges to students as a reference book for the present and, hopefully, future modified courses. The academicians may find this book useful for redesigning the present Diploma (Electronics), B.Sc. (Electronics), B.Sc. (Instrumentation), B.E. and M.E. / M.Tech (Electrical, Electronic, Instrumentation) syllabus.