Description
Cengage Surface Mount Technology for PC Boards 2005 Edition by HOLLOMON, Blackwell
Learn to generate high manufacturing yields, low testing costs, and reproducible designs using the latest components of surface mount technology (SMT)! Manufacturers, managers, engineers, students, and others who work with printed-circuit boards will find a wealth of cutting-edge information about SMT and fine pitch technology (FPT) in this new edition. Practical data and clear illustrations combine to clearly and accurately present the details of design-for-manufacturability, environmental compliance, design-for-test, and quality/reliability for today's miniaturized electronics packaging. Table of contents :- An Introduction to Surface Mount TechnologySurface-MountComponents (SMCs)SMT Manufacturing MethodsSystem Design Considerations for SMTPrinted-Wiring Layout UsingSMTsAssembly-Level Packaging and InterconnectionsQuality Assurance in SMTSMT and Design for ManufacturabilityHybrid Circuits and Multi-Chip Modules (MCMs)